Littelfuse SP1010 Series Manuel d'utilisateur télécharger pdf (Page 4)

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™

Family of Products)

Revision: March 20, 2012

SP1010 Series

General Purpose ESD Protection - SP1010 Series

Embossed Carrier Tape & Reel Speciﬁcation — μDFN-6 (1.25x1.0x0.5mm)

Ordering Information

Part Number Package Marking Min. Order Qty.

SP1010-04UTG µDFN-6 (1.25x1.0x0.5mm) H4 3000

Product Characteristics

Lead Plating Pre-Plated Frame

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte ﬁnish VDI 11-13.

Part Numbering System

Part Marking System

SP 1010 04 U T G

Series

Number of

Channels

Package

U: μDFN-6

T= Tape & Reel

G= Green

–

Silicon Protection

Array (SPA

)

Family of

TVS Diode Arrays

Product Series

Number of Channels

H = SP1010

Symbol

Millimeters Inches

Min Max Min Max

E 1.65 1.85 0.06 0.07

F 3.45 3.55 0.14 0.14

D1 0.50 0.65 0.02 0.03

D 1.50 MIN 0.06 MIN

P0 3.90 4.10 0.15 0.16

10P0 40.0 +/- 0.20 1.57 +/- 0.01

W 7.90 8.30 0.31 0.33

P2 1.95 2.05 0.08 0.08

A0 1.09 1.19 0.04 0.05

B0 1.42 1.52 0.06 0.06

K0 0.71 0.81 0.03 0.03

t 0.25 TYP 0.01 TYP

1 2 3 4

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Littelfuse SP1010 Series Manuel d'utilisateur Page 4

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