Littelfuse SP1010 Series Manuel d'utilisateur télécharger pdf (Page 3)

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™

Family of Products)

Revision: March 20, 2012

SP1010 Series

SP1010

General Purpose ESD Protection - SP1010 Series

Package Dimensions — μDFN-6 (1.25x1.0x0.5mm)

Package μDFN-6 (1.25x1.0x0.5mm)

JEDEC MO-229

Symbol

Millimeters Inches

Min Max Min Max

A 0.45 0.55 0.018 0.022

A1 0.00 0.05 0.000 0.002

A3 0.127 REF 0.005 REF

b 0.15 0.25 0.006 0.010

D 1.20 1.30 0.047 0.051

D2 ----

E 0.95 1.05 0.037 0.041

E2 ----

e 0.4 REF 0.016 REF

L 0.25 0.35 0.010 0.014

6 5 4

Top View

Pin 1 Index Area

Pin 1 chamfer

0.10 x 45’

℮

0.05 C

Bottom View

0.05 C

0.05

Seating plane

Side View

0.10

0.05

Recommanded Soldering Pad for µDFN-6L 1.25 x1.0x0.5 mm

1.1

0.4

0.1

0.3

0.4

1.1

Total:+/- 0.01mm

Time

Temperature

S(max)

S(min)

time to peak temperature

Preheat

rehea

Ramp-up

amp-up

Ramp-down

amp-d

Critical Zone

L to TP

ritical Zon

Reﬂow Condition Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

) 150°C

- Temperature Max (T

s(max)

) 200°C

- Time (min to max) (t

) 60 – 180 secs

Average ramp up rate (Liquidus) Temp

) to peak

3°C/second max

S(max)

to T

- Ramp-up Rate 3°C/second max

Reﬂow

- Temperature (T

) (Liquidus) 217°C

- Temperature (t

) 60 – 150 seconds

Peak Temperature (T

) 260

+0/-5

°C

Time within 5°C of actual peak

Temperature (t

)

20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

) 8 minutes Max.

Do not exceed 260°C

Soldering Parameters

1 2 3 4

Commentaires sur ces manuels

Pas de commentaire

Littelfuse SP1010 Series Manuel d'utilisateur Page 3

Commentaires sur ces manuels

Produits connexes et manuels pour Matériel Littelfuse SP1010 Series