Littelfuse SP3002 Series Manuel d'utilisateur télécharger pdf (Page 4)

Speciﬁcations are subject to change without notice.

Revised: 11/25/13

TVS Diode Arrays (SPA

Diodes)

Low Capacitance ESD Protection - SP3002 Series

Package Dimensions — SC70-6

Package SC70-6

Pins 6

JEDEC MO-203

Millimeters Inches

Min Max Min Max

A 0.80 1. 10 0.031 0.043

A1 0.00 0.10 0.000 0.004

A2 0.70 1. 0 0 0.028 0.039

B 0.15 0.30 0.006 0.012

c 0.08 0.25 0.003 0.010

D 1.85 2.25 0.073 0.089

E 1. 15 1.35 0.045 0.053

e 0.65 BSC 0.026 BSC

HE 2.00 2.40 0.079 0.094

L 0.26 0.46 0.010 0.018

Solder Pad Layout

Package Dimensions — SOT23-6

Package SOT23-6

Pins 6

JEDEC MO-178

Millimeters Inches

Notes

Min Max Min Max

A 0.900 1.450 0.035 0.057 -

A1 0.000 0.150 0.000 0.006 -

A2 0.900 1.300 0.035 0.051 -

b 0.350 0.500 0.0138 0.0196 -

C 0.080 0.220 0.0031 0.009 -

D 2.800 3.000 0.11 0.118 3

E 2.600 3.000 0.102 0.118 -

E1 1.500 1.750 0.06 0.069 3

e 0.95 Ref 0.0374 Ref -

e1 1.9 Ref 0.0748 Ref -

L 0.100 0.600 0.004 0.023 4,5

N 6 6 6

a 0º 10º 0º 10º -

M 2.590 0.102 -

O 0.690 .027 TYP -

P 0.990 .039 TYP -

R 0.950 0.038 -

Recommended Solder Pad Layout

Notes:

1. Dimensioning and tolerances per ANSI 14.5M-1982.

2. Package conforms to EIAJ SC-74 (1992).

3. Dimensions D and E1 are exclusive of mold ﬂash, protrusions, or gate burrs.

4. Footlenth L measured at reference to seating plane.

5. “L” is the length of ﬂat foot surface for soldering to substrate.

6. “N” is the number of terminal positions.

7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily

exact.

1 2 3 4 5 6

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Littelfuse SP3002 Series Manuel d'utilisateur Page 4

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